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info@ultima-circuits.com


Technology/Capability


Product
Rigid Double-sided
Rigid Miltilayer (4 - 12 Layers)

Laminate
FR4 (Multilayer & Double-sided)

Line Width / Spacing
5 / 5 Mil

Plated Hole Size
Minimum .010 Drilled, .005 Finished

Warp and Twist
> 1%

Basic Copper Thickness
0.5, 1.0, 2.0 oz

Soldermask
Liquid Photo-imageable
Dry Film
Board Finishing Type
SMOBC
Tin / Lead
Full Body Gold
Deep or Tab Plated NI / Gold

Maximum Panel Size
21 X 25

Other
Impedance Control
Carbon Ink

Quality
UL Approved
ISO 9002 Certification in process

Electrical Test:
100% of Boards Tested
Universal Fixturing
Clamshell / Bed of Nail Fixtures
Net List Extraction
AOI